Rolf Alfons Aschenbrenner (born c. 1964) is an engineer who works for Fraunhofer IZM in Berlin, Germany. He was named a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2013 "for contributions to microelectronic packaging".[1]
Biography
In 1986, Aschenbrenner received a Bachelor of Science degree in mechanical engineering from the University of Giessen, followed in 1991 by a Master of Science degree in physics from the same university. He then worked at the university until 1992 during which he helped with a project for Spacelab mission D2. In 1993, Aschenbrenner worked at Technische Universität Berlin before joining Fraunhofer in March 1994.[2]
In October 2010, Aschenbrenner was appointed as deputy head of Fraunhofer IZM, where he coheaded its System Integration and Interconnection Technologies department. He is a senior member of IEEE and has supported its Components, Packaging, & Manufacturing Technology (CPMT) Society, working in multiple committees and serving in two vice presidential positions. Aschenbrenner became CPMT president in January 2010[3] and served until December 2011.[2] In 2017, CPMT changed its name to the Electronics Packaging Society (EPS).[4]
Aschenbrenner has written or contributed to more than 100 journal and proceedings articles on electronic packaging, and has more than 14 patents related to microelectronic packaging. He received a "best paper award" at a 1995 conference and an international recognition award in 2005 from an electronics manufacturers R&D consortium.[3][2]
References
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| People | |
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| Institutes | | Germany |
- Additive Production Technologies (IAPT)
- Algorithms and Scientific Computing (SCAI)
- Applied Information Technology (FIT)
- Applied and Integrated Security (AISEC)
- Applied Optics and Precision Engineering (IOF)
- Applied Polymer Research (IAP)
- Applied Solid State Physics (IAF)
- Fab Battery Cells (FFB)
- Biomedical Engineering (IBMT)
- Building Physics (IBP)
- Casting, Composite and Processing Technology (IGCV)
- Cell Therapy and Immunology (IZI)
- Ceramic Technologies and Systems (IKTS)
- Chemical Technology (ICT)
- Communication, Information Processing and Ergonomics (FKIE)
- Computer Graphics Research (IGD)
- Digital Media Technology (IDMT)
- Digital Medicine (MEVIS)
- Electron Beam and Plasma Technology (FEP)
- Electronic Nano Systems (ENAS)
- Energy Economics and Energy System Technology (IEE)
- Energy Infrastructures and Geothermal Systems (IEG)
- Environmental, Safety and Energy Technology (UMSICHT)
- Cognitive Systems (IKS)
- Experimental Software Engineering (IESE)
- Factory Operation and Automation (IFF)
- High Frequency Physics and Radar Techniques (FHR)
- High-Speed Dynamics (Ernst-Mach-Institute) (EMI)
- Individualized and Cell-Based Medical Engineering (IMTE)
- Industrial Engineering (IAO)
- Industrial Mathematics (ITWM)
- Information Center for Planning and Building (IRB)
- Integrated Circuits (IIS)
- Integrated Systems and Device Technology (IISB)
- Intelligent Analysis and Information Systems (IAIS)
- Interfacial Engineering and Biotechnology (IGB)
- Large Structures in Production Engineering (IGP)
- Laser Technology (ILT)
- Machine Tools and Forming Technology (IWU)
- Manufacturing Technology and Advanced Materials (IFAM)
- Manufacturing Engineering and Automation (IPA)
- Material and Beam Technology (IWS)
- Material Flow and Logistics (IML)
- Materials Recycling and Resource Strategies (IWKS)
- Mechanics of Materials (IWM)
- Mechatronic Systems Design (IEM)
- Microelectronic Circuits and Systems (IMS)
- Microengineering and Microsystems (IMM)
- Microstructure of Materials and Systems (IMWS)
- Microsystems and Solid State Technologies (EMFT)
- Molecular Biology and Applied Ecology (IME)
- Nondestructive Testing (IZFP)
- Optronics, System Technologies and Image Exploitation (IOSB)
- Open Communication Systems (FOKUS)
- Photonic Microsystems (IPMS)
- Physical Measurement Techniques (IPM)
- Process Engineering and Packaging (IVV)
- Production Systems and Design Technology (IPK)
- Production Technology (IPT)
- Reliability and Microintegration (IZM)
- Secure Information Technology (SIT)
- Silicate Research (ISC)
- Silicon Technology (ISIT)
- Software and Systems Engineering (ISST)
- Solar Energy Systems (ISE)
- Structural Durability and System Reliability (LBF)
- Surface Engineering and Thin Films (IST)
- Systems and Innovation Research (ISI)
- Technological Trend Analysis (INT)
- Telecommunications (Heinrich Hertz Institute) (HHI)
- Toxicology and Experimental Medicine (ITEM)
- Translational Medicine and Pharmacology (ITMP)
- Transportation and Infrastructure Systems (IVI)
- Wind Energy Systems (IWES)
- Wood Research Wilhelm-Klauditz-Institut (WKI)
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| United States |
- Manufacturing Innovation, Massachusetts (CMI)
- Mid-Atlantic, Maryland (CMA)
- Midwest, Michigan (CMW)
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| United Kingdom |
- Applied Photonics, Scotland (CAP)
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